Manuscripts

Abraham Lincoln, Springfield, Illinois, letter to Oliver L. Davis, Danville, Illinois

Description: Autograph letter signed. Includes a memorandum regarding a deed for a right of way and addressed envelope. (1 page)
Type: Manuscripts(Opens in new tab)
Date: 1854 June 22
Call number: HM 22666
Creator: Lincoln, Abraham (1809-1865)(Opens in new tab)
Provenance: Purchased from Anderson Galleries, Lambert Lincolniana collection, January and April 1914.; Purchased from Judd Stewart, 1922.; Purchased from Anderson Galleries, Lambert Civil War collection, March 1914.; Purchased from Anderson Galleries, Mark P. Robinson collection, February-March 1918.

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